Responsibilities:

• Collaborate closely with Failure Analysis Engineers to test and evaluate new processes, customer returns, and new semiconductor products
• Independently perform laboratory and failure analysis testing, including data collection and analysis
• Prepare clear, accurate documentation and presentations for engineering and cross-functional meetings
• Generate, maintain, and review detailed work logs, reports, and records to ensure compliance with company and industry standards
• Utilize advanced microscopy techniques, including Scanning Electron Microscopy (SEM), Backscatter imaging, and Focused Ion Beam (FIB) analysis
• Follow established procedures while contributing to continuous improvement initiatives within the engineering and manufacturing teams

Requirements:

• Associate’s in Engineering, Electronics, Semiconductor Technology, or a related technical field (or equivalent hands-on experience) preferred
• Prior experience working in a semiconductor manufacturing strongly preferred
• Hands-on experience with microscopy techniques such as SEM, Backscatter, and FIB strongly preferred
• Ability to work independently while managing multiple tests, documentation tasks, and priorities
• Strong attention to detail with excellent technical documentation and reporting skills
• Familiarity with quality, compliance, and safety standards in a manufacturing or lab setting
• Will be required to pass a criminal background check